Difference between revisions of "Product Safety & Cautions"

Latest revision as of 13:29, 3 November 2016

NOTE

The warnings on this page are intended to provide a broad overview of actions that may damage your product and/or attached systems, overheat, or cause a fire. Additional product specific warnings may exist. See the Technical Reference Manual of your particular product for additional warnings and details.

General Products

• As with all electronic subsystems and circuits, observe proper ESD handling procedures.

• Do not attempt to disassemble the module or solder components or wires to the module; this may render your board non-functional and will void your warranty.

• Do not twist or bend LCD or PCB components as the unit may be permanently damaged.

• For units with serial FLASH, do not write to serial FLASH’s OTP region. This region is reserved for manufacturing and configuration information by Serious. Modifying or writing to this area will void your warranty with Serious and render the module unusable.

• Ensure sufficient wire size for wire harnesses to avoid wire overheating and adequate power handling capability.

• Gently plug/unplug the wire harness connectors to avoid damage to the SIM/SCM.

• Plugging connectors into incompatible devices may damage the SCM or connected device.

• Several signals on the connector are directly connected to signals on other connectors. Ensure that common signal connections are appropriate or you may damage your module or connected equipment.

Serious Integrated Modules (SIMs)

• USE 5VDC ONLY to power the SIM. Using an incorrect adapter (e.g. 9V, 12V) will permanently destroy the SIM. The SIM does not contain an over-voltage input protection circuit.

• Be careful to connect the right power connections on any wire harness to avoid damaging your SIM.

• There are specific power limitations on the MCU pins. Consult the data sheet for your processor for more information. Exceeding these limits may damage your board or attached systems, overheat, or cause a fire.

• Operation or storage at temperatures outside of LCD range limits may cause the LCD to become difficult to read, non-functional, or cause permanent damage to the unit.

• Be very careful when handling the edge of the SIM where the flexible cable from the LCD panel is exposed. This can be easily damaged or ripped if shear-force is applied in handling.

• As with any glass product, use reasonable care when handling to avoid glass chips and cracks.

• If the LCD glass breaks and the LCD liquid materials escape, avoid contact with bare skin. Wash exposed skin with soap and water immediately and dispose of the product according to local materials handling procedures.

• If the SIM comes with a protective film on the LCD, we recommend leaving this film in place until the SIM is mounted in the final assembly. Do not expose to high temperature and/or high humidity testing with the protective film in place. Remove the protective film slowly to minimize the risk of generating static electricity.

• On touch variants, NEVER use sharp objects to activate the touch screen.

• Do not use abrasive, ketone-containing, and aromatic solvents which will damage polarizer materials.

• Do not over-tighten or use daughter card screws longer than 6mm. This may cause permanent damage to the SIM.

• Connecting more than one power source to the SIM +VEXT signals simultaneously may damage your SIM or even connected equipment. Only one connector should drive the +VEXT signal. The remaining connectors can, within the limits of the SIM, receive power from this signal.

Serious Communications Modules (SCMs)

• Always be sure the SCM and SIM are not powered when connecting them together.

• Do not mate the two boards unless they are well-aligned; you will irreparably damage the board-to-board connectors.

• Do not over-tighten or use screws longer than 6mm. This may cause permanent damage to the SIM.

• Most SIMs have numerous ways to apply power; ensure the SCM is going to be the only power provider to avoid possible damage to the SCM, SIM, or attached power sources.

• Pay careful attention to the polarity of the power input. It is not protected against reverse voltage and miswiring will damage your SCM and any attached SIM.

• When using a FINE Adapter, incorrect shunt/jumper placement may damage your SCM, debugger, and/or any other attached devices; always place the jumper in the correct position before attaching the TC2050 to the SCM and the debugger.

• Connecting a +5V power source to the SCM +5V pins of expansion connectors may damage your SCM, SIM or other connected equipment. Only power from +VIN or +VEXT should drive the +5V power output.

• If you use the SIM_RESET# capability, do not configure this pin as a push pull output to avoid potential conflicts with the on SIM reset circuitry.

• The term “2-wire RS485” is a misnomer when it refers to differential half duplex RS485. You must also have a third wire, the shared network ground. If you do not connect the ground, the RS485 differential signal can have a common mode offset that has the potential of physically damaging your SCM. See this article for a more detailed description of this issue.

• Do not simultaneously drive over-multiplexed pins on this port or you will damage the MCU – ensure only one MCU port pin is configured as an output at any time.